Project Name: High end silicon-based chip packaging and testing project

Project location:Yancheng

Building scale:122000㎡

Time: 2023

Service scope:Whole process design

Key Features:Silicon based chip packaging and testing park

Confidentiality NoticeThis case involves the client's trade secrets, and it is strictly prohibited to reprint or quote them in any form to the outside world. Violators will be held accountable in accordance with the law.