Electronic Semiconductor

服务晶圆厂、封测厂与上游配套企业,沉淀标准化交付经验。

CHIPBOND TECHNOLOGY MALAYSIA SDN. BHD.

Project: EPC general contracting for the renovation of existing factory buildings

Location:Penang, Malaysia

Time:2025

Building scale: 26783㎡

Service scope:Mechanical and electrical design and construction, high-purity process pipelines, wastewater and exhaust gas treatment systems, facility monitoring and control systems (FMCS)

Key processes:Semiconductor Packaging and Testing

Confidentiality NoticeThis case involves the client's trade secrets, and it is strictly prohibited to reprint or quote them in any form to the outside world. Violators will be held accountable in accordance with the law.